Isolation switching for backup memory

ABSTRACT

Certain embodiments described herein include a memory system having a volatile memory subsystem, a non-volatile memory subsystem, a controller coupled to the non-volatile memory subsystem, and a circuit coupled to the volatile memory subsystem, to the controller, and to a host system. In a first mode of operation, the circuit is operable to selectively isolate the controller from the volatile memory subsystem, and to selectively couple the volatile memory subsystem to the host system to allow data to be communicated between the volatile memory subsystem and the host system. In a second mode of operation, the circuit is operable to selectively couple the controller to the volatile memory subsystem to allow data to be communicated between the volatile memory subsystem and the nonvolatile memory subsystem using the controller, and the circuit is operable to selectively isolate the volatile memory subsystem from the host system.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.14/173,219, titled “Isolation Switching For Backup Memory,” filed Feb.5, 2014, which is a continuation of U.S. patent application Ser. No.13/905,048, titled “Isolation Switching For Backup Memory,” filed May29, 2013, now U.S. Pat. No. 8,671,243, issued Mar. 11, 2014, which is acontinuation of U.S. patent application Ser. No. 13/536,173, titled“Data Transfer Scheme For Non-Volatile Memory Module,” filed Jun. 28,2012, now U.S. Pat. No. 8,516,187, issued Aug. 20, 2013, which is adivisional of U.S. patent application Ser. No. 12/240,916, titled“Non-Volatile Memory Module,” filed Sep. 29, 2008, now U.S. Pat. No.8,301,833, issued Oct. 30, 2012, which is a continuation of U.S. patentapplication Ser. No. 12/131,873, filed Jun. 2, 2008, which claims thebenefit of U.S. Provisional Application No. 60/941,586, filed Jun. 1,2007, the contents of which are incorporated by reference herein intheir entirety.

This application may be considered related to U.S. patent applicationSer. No. 14/173,242, titled “Isolation Switching For Backup OfRegistered Memory,” filed Feb. 5, 2014, which is a continuation of U.S.patent application Ser. No. 13/905,053, titled “Isolation Switching ForBackup Of Registered Memory,” filed May 29, 2013, now U.S. Pat. No.8,677,060, issued Mar. 18, 2014, which is a continuation of U.S. patentapplication Ser. No. 13/536,173, titled “Data Transfer Scheme ForNon-Volatile Memory Module,” filed Jun. 28, 2012, now U.S. Pat. No.8,516,187, issued Aug. 20, 2013, which is a divisional of U.S. patentapplication Ser. No. 12/240,916, titled “Non-Volatile Memory Module,”filed Sep. 29, 2008, now U.S. Pat. No. 8,301,833, issued Oct. 30, 2012,which is a continuation of U.S. patent application Ser. No. 12/131,873,filed Jun. 2, 2008, now abandoned, which claims the benefit of U.S.Provisional Application No. 60/941,586, filed Jun. 1, 2007, the contentsof which are incorporated by reference herein in their entirety.

BACKGROUND

Certain types of memory modules comprise a plurality of dynamicrandom-access memory (DRAM) devices mounted on a printed circuit board(PCB). These memory modules are typically mounted in a memory slot orsocket of a computer system (e.g., a server system or a personalcomputer) and are accessed by the computer system to provide volatilememory to the computer system.

Volatile memory generally maintains stored information only when it ispowered. Batteries have been used to provide power to volatile memoryduring power failures or interruptions. However, batteries may requiremaintenance, may need to be replaced, are not environmentally friendly,and the status of batteries can be difficult to monitor.

Non-volatile memory can generally maintain stored information whilepower is not applied to the non-volatile memory. In certaincircumstances, it can therefore be useful to backup volatile memoryusing non-volatile memory.

SUMMARY

Disclosed herein is a memory system having a volatile memory subsystem,a non-volatile memory subsystem, a controller coupled to thenon-volatile memory subsystem, and a circuit coupled to the volatilememory subsystem, to the controller, and to a host system. In a firstmode of operation, the circuit is operable to selectively isolate thecontroller from the volatile memory subsystem, and to selectively couplethe volatile memory subsystem to the host system to allow data to becommunicated between the volatile memory subsystem and the host system.In a second mode of operation, the circuit is operable to selectivelycouple the controller to the volatile memory subsystem to allow data tobe communicated between the volatile memory subsystem and thenonvolatile memory subsystem using the controller, and the circuit isoperable to selectively isolate the volatile memory subsystem from thehost system.

Also disclosed herein is a method for operating a memory system. Themethod includes coupling a circuit to a host system, a volatile memorysubsystem, and a controller, wherein the controller is coupled to anon-volatile memory subsystem. In a first mode of operation that allowsdata to be communicated between the volatile memory subsystem and thehost system, the circuit is used to (i) selectively isolate thecontroller from the volatile memory subsystem, and (ii) selectivelycouple the volatile memory subsystem to the host system. In a secondmode of operation that allows data to be communicated between thevolatile memory subsystem and the nonvolatile memory subsystem via thecontroller, the circuit is used to (i) selectively couple the controllerto the volatile memory subsystem, and (ii) selectively isolate thevolatile memory subsystem from the host system.

Also disclosed herein is a nontransitory computer readable storagemedium storing one or more programs configured to be executed by one ormore computing devices. The programs, when executing on the one or morecomputing devices, cause a circuit that is coupled to a host system, toa volatile memory subsystem, and to a controller that is coupled to anon-volatile memory subsystem, to perform a method in which, in a firstmode of operation that allows data to be communicated between thevolatile memory subsystem and the host system, operating the circuit to(i) selectively isolate the controller from the volatile memorysubsystem, and (ii) selectively couple the volatile memory subsystem tothe host system. In a second mode of operation that allows data to becommunicated between the volatile memory subsystem and the nonvolatilememory subsystem via the controller, operating the circuit to (i)selectively couple the controller to the volatile memory subsystem, and(ii) selectively isolate the volatile memory subsystem from the hostsystem.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram of an example memory system compatible withcertain embodiments described herein.

FIG. 2 is a block diagram of an example memory module with ECC(error-correcting code) having a volatile memory subsystem with ninevolatile memory elements and a non-volatile memory subsystem with fivenon-volatile memory elements in accordance with certain embodimentsdescribed herein.

FIG. 3 is a block diagram of an example memory module having amicrocontroller unit and logic element integrated into a single devicein accordance with certain embodiments described herein.

FIGS. 4A-4C schematically illustrate example embodiments of memorysystems having volatile memory subsystems comprising registered dualin-line memory modules in accordance with certain embodiments describedherein.

FIG. 5 schematically illustrates an example power module of a memorysystem in accordance with certain embodiments described herein.

FIG. 6 is a flowchart of an example method of providing a first voltageand a second voltage to a memory system including volatile andnon-volatile memory subsystems.

FIG. 7 is a flowchart of an example method of controlling a memorysystem operatively coupled to a host system and which includes at least100 percent more storage capacity in non-volatile memory than involatile memory.

FIG. 8 schematically illustrates an example clock distribution topologyof a memory system in accordance with certain embodiments describedherein.

FIG. 9 is a flowchart of an example method of controlling a memorysystem operatively coupled to a host system, the method includingoperating a volatile memory subsystem at a reduced rate in a back-upmode.

FIG. 10 schematically illustrates an example topology of a connection totransfer data slices from two DRAM segments of a volatile memorysubsystem of a memory system to a controller of the memory system.

FIG. 11 is a flowchart of an example method of controlling a memorysystem operatively coupled to a host system, the method includingbacking up and/or restoring a volatile memory subsystem in slices.

DETAILED DESCRIPTION

Certain embodiments described herein include a memory system which cancommunicate with a host system such as a disk controller of a computersystem. The memory system can include volatile and non-volatile memory,and a controller. The controller backs up the volatile memory using thenon-volatile memory in the event of a trigger condition. Triggerconditions can include, for example, a power failure, power reduction,request by the host system, etc. In order to power the system in theevent of a power failure or reduction, the memory system can include asecondary power source which does not comprise a battery and mayinclude, for example, a capacitor or capacitor array.

In certain embodiments, the memory system can be configured such thatthe operation of the volatile memory is not adversely affected by thenon-volatile memory or by the controller when the volatile memory isinteracting with the host system. For example, one or more isolationdevices may isolate the non-volatile memory and the controller from thevolatile memory when the volatile memory is interacting with the hostsystem and may allow communication between the volatile memory and thenon-volatile memory when the data of the volatile memory is beingrestored or backed-up. This configuration generally protects theoperation of the volatile memory when isolated while providing backupand restore capability in the event of a trigger condition, such as apower failure.

In certain embodiments described herein, the memory system includes apower module which provides power to the various components of thememory system from different sources based on a state of the memorysystem in relation to a trigger condition (e.g., a power failure). Thepower module may switch the source of the power to the variouscomponents in order to efficiently provide power in the event of thepower failure. For example, when no power failure is detected, the powermodule may provide power to certain components, such as the volatilememory, from system power while charging a secondary power source (e.g.,a capacitor array). In the event of a power failure or other triggercondition, the power module may power the volatile memory elements usingthe previously charged secondary power source.

In certain embodiments, the power module transitions relatively smoothlyfrom powering the volatile memory with system power to powering it withthe secondary power source. For example, the power system may powervolatile memory with a third power source from the time the memorysystem detects that power failure is likely to occur until the time thememory system detects that the power failure has actually occurred.

In certain embodiments, the volatile memory system can be operated at areduced frequency during backup and/or restore operations which canimprove the efficiency of the system and save power. In someembodiments, during backup and/or restore operations, the volatilememory communicates with the non-volatile memory by writing and/or,reading data words in bit-wise slices instead of by writing entire wordsat once. In certain embodiments, when each slice is being written to orread from the volatile memory the unused slice(s) of volatile memory isnot active, which can reduce the power consumption of the system.

In yet other embodiments, the non-volatile memory can include at least100 percent more storage capacity than the volatile memory. Thisconfiguration can allow the memory system to efficiently handlesubsequent trigger conditions.

FIG. 1 is a block diagram of an example memory system 10 compatible withcertain embodiments described herein. The memory system 10 can becoupled to a host computer system and can include a volatile memorysubsystem 30, a non-volatile memory subsystem 40, and a controller 62operatively coupled to the non-volatile memory subsystem 40. In certainembodiments, the memory system 10 includes at least one circuit 52configured to selectively operatively decouple the controller 62 fromthe volatile memory subsystem 30.

In certain embodiments, the memory system 10 comprises a memory module.The memory system 10 may comprise a printed-circuit board (PCB) 20. Incertain embodiments, the memory system 10 has a memory capacity of512-MB, 1-GB, 2-GB, 4-GB, or 8-GB. Other volatile memory capacities arealso compatible with certain embodiments described herein. In certainembodiments, the memory system 10 has a non-volatile memory capacity of512-MB, 1-GB, 2-GB, 4-GB, 8-GB, 16-GB, or 32-GB. Other non-volatilememory capacities are also compatible with certain embodiments describedherein. In addition, memory systems 10 having widths of 4 bytes, 8bytes, 16 bytes, 32 bytes, or 32 bits, 64 bits, 128 bits, 256 bits, aswell as other widths (in bytes or in bits), are compatible withembodiments described herein. In certain embodiments, the PCB 20 has anindustry-standard form factor. For example, the PCB 20 can have a lowprofile (LP) form factor with a height of 30 millimeters and a width of133.35 millimeters. In certain other embodiments, the PCB 20 has a veryhigh profile (VHP) form factor with a height of 50 millimeters or more.In certain other embodiments, the PCB 20 has a very low profile (VLP)form factor with a height of 18.3 millimeters. Other form factorsincluding, but not limited to, small-outline (SO-DIMM), unbuffered(UDIMM), registered (RDIMM), fully-buffered (FBDIMM), miniDIMM,mini-RDIMM, VLP mini-DIMM, micro-DIMM, and SRAM DIMM are also compatiblewith certain embodiments described herein. For example, in otherembodiments, certain non-DIMM form factors are possible such as, forexample, single in-line memory module (SIMM), multi-media card (MMC),and small computer system interface (SCSI).

In certain preferred embodiments, the memory system 10 is in electricalcommunication with the host system. In other embodiments, the memorysystem 10 may communicate with a host system using some other type ofcommunication, such as, for example, optical communication. Examples ofhost systems include, but are not limited to, blade servers, 1U servers,personal computers (PCs), and other applications in which space isconstrained or limited. The memory system 10 can be in communicationwith a disk controller of a computer system, for example. The PCB 20 cancomprise an interface 22 that is configured to be in electricalcommunication with the host system (not shown). For example, theinterface 22 can comprise a plurality of edge connections which fit intoa corresponding slot connector of the host system. The interface 22 ofcertain embodiments provides a conduit for power voltage as well asdata, address, and control signals between the memory system 10 and thehost system. For example, the interface 22 can comprise a standard240-pin DDR2 edge connector.

The volatile memory subsystem 30 comprises a plurality of volatilememory elements 32 and the non-volatile memory subsystem 40 comprises aplurality of non-volatile memory elements 42. Certain embodimentsdescribed herein advantageously provide non-volatile storage via thenon-volatile memory subsystem 40 in addition to high-performance (e.g.,high speed) storage via the volatile memory subsystem 30. In certainembodiments, the first plurality of volatile memory elements 32comprises two or more dynamic random-access memory (DRAM) elements.Types of DRAM elements 32 compatible with certain embodiments describedherein include, but are not limited to, DDR, DDR2, DDR3, and synchronousDRAM (SDRAM). For example, in the block diagram of FIG. 1, the firstmemory bank 30 comprises eight 64 M×8 DDR2 SDRAM elements 32. Thevolatile memory elements 32 may comprise other types of memory elementssuch as static random-access memory (SRAM). In addition, volatile memoryelements 32 having bit widths of 4, 8, 16, 32, as well as other bitwidths, are compatible with certain embodiments described herein.Volatile memory elements 32 compatible with certain embodimentsdescribed herein have packaging which include, but are not limited to,thin small-outline package (TSOP), ball-grid-array (BGA), fine-pitch BGA(FBGA), micro-BGA (1.1,BGA), mini-BGA (mBGA), and chip-scale packaging(CSP).

In certain embodiments, the second plurality of non-volatile memoryelements 42 comprises one or more flash memory elements. Types of flashmemory elements 42 compatible with certain embodiments described hereininclude, but are not limited to, NOR flash, NAND flash, ONE-NAND flash,and multi-level cell (MLC). For example, in the block diagram of FIG. 1,the second memory bank 40 comprises 512 MB of flash memory organized asfour 128 Mb×8 NAND flash memory elements 42. In addition, nonvolatilememory elements 42 having bit widths of 4, 8, 16, 32, as well as otherbit widths, are compatible with certain embodiments described herein.Non-volatile memory elements 42 compatible with certain embodimentsdescribed herein have packaging which include, but are not limited to,thin small-outline package (TSOP), ball-grid-array (BGA), fine-pitch BGA(FBGA), micro-BGA (PGA), mini-BGA (mBGA), and chip-scale packaging(CSP).

FIG. 2 is a block diagram of an example memory module 10 with ECC(error-correcting code) having a volatile memory subsystem 30 with ninevolatile memory elements 32 and a non-volatile memory subsystem 40 withfive non-volatile memory elements 42 in accordance with certainembodiments described herein. The additional memory element 32 of thefirst memory bank 30 and the additional memory element 42 of the secondmemory bank 40 provide the ECC capability. In certain other embodiments,the volatile memory subsystem 30 comprises other numbers of volatilememory elements 32 (e.g., 2, 3, 4, 5, 6, 7, more than 9). In certainembodiments, the non-volatile memory subsystem 40 comprises othernumbers of non-volatile memory elements 42 (e.g., 2, 3, more than 5).

Referring to FIG. 1, in certain embodiments, the logic element 70comprises a field-programmable gate array (FPGA). In certainembodiments, the logic element 70 comprises an FPGA available fromLattice Semiconductor Corporation which includes an internal flash. Incertain other embodiments, the logic element 70 comprises an FPGAavailable from another vendor. The internal flash can improve the speedof the memory system 10 and save physical space. Other types of logicelements 70 compatible with certain embodiments described hereininclude, but are not limited to, a programmable-logic device (PLD), anapplication-specific integrated circuit (ASIC), a custom-designedsemiconductor device, a complex programmable logic device (CPLD). Incertain embodiments, the logic element 70 is a custom device. In certainembodiments, the logic element 70 comprises various discrete electricalelements, while in certain other embodiments, the logic element 70comprises one or more integrated circuits. FIG. 3 is a block diagram ofan example memory module 10 having a microcontroller unit 60 and logicelement 70 integrated into a single controller 62 in accordance withcertain embodiments described herein. In certain embodiments, thecontroller 62 includes one or more other components. For example, in oneembodiment, an FPGA without an internal flash is used and the controller62 includes a separate flash memory component which stores configurationinformation to program the FPGA.

In certain embodiments, the at least one circuit 52 comprises one ormore switches coupled to the volatile memory subsystem 30, to thecontroller 62, and to the host computer (e.g., via the interface 22, asschematically illustrated by FIGS. 1-3). The one or more switches areresponsive to signals (e.g., from the controller 62) to selectivelyoperatively decouple the controller 62 from the volatile memorysubsystem 30 and to selectively operatively couple the controller 62 tothe volatile memory subsystem 30. In addition, in certain embodiments,the at least one circuit 52 selectively operatively couples anddecouples the volatile memory subsystem 30 and the host system.

In certain embodiments, the volatile memory subsystem 30 can comprise aregistered DIMM subsystem comprising one or more registers 160 and aplurality of DRAM elements 180, as schematically illustrated by FIG. 4A.In certain such embodiments, the at least one circuit 52 can compriseone or more switches 172 coupled to the controller 62 (e.g., logicelement 70) and to the volatile memory subsystem 30 which can beactuated to couple and decouple the controller 62 to and from thevolatile memory subsystem 30, respectively. The memory system 10 furthercomprises one or more switches 170 coupled to the one or more registers160 and to the plurality of DRAM elements 180 as schematicallyillustrated by FIG. 4A. The one or more switches 170 can be selectivelyswitched, thereby selectively operatively coupling the volatile memorysubsystem 30 to the host system 150. In certain other embodiments, asschematically illustrated by FIG. 4B, the one or more switches 174 arealso coupled to the one or more registers 160 and to a power source 162for the one or more registers 160. The one or more switches 174 can beselectively switched to turn power on or off to the one or moreregisters 160, thereby selectively operatively coupling the volatilememory subsystem 30 to the host system 150. As schematically illustratedby FIG. 4C, in certain embodiments the at least one circuit 52 comprisesa dynamic on-die termination (ODT) 176 circuit of the logic element 70.For example, the logic element 70 can comprise a dynamic ODT circuit 176which selectively operatively couples and decouples the logic element 70to and from the volatile memory subsystem 30, respectively. In addition,and similar to the example embodiment of FIG. 4A described above, theone or more switches 170 can be selectively switched, therebyselectively operatively coupling the volatile memory subsystem 30 to thehost system 150.

Certain embodiments described herein utilize the non-volatile memorysubsystem 40 as a flash “mirror” to provide backup of the volatilememory subsystem 30 in the event of certain system conditions. Forexample, the non-volatile memory subsystem 40 may backup the volatilememory subsystem 30 in the event of a trigger condition, such as, forexample, a power failure or power reduction or a request from the hostsystem. In one embodiment, the non-volatile memory subsystem 40 holdsintermediate data results in a noisy system environment when the hostcomputer system is engaged in a long computation. In certainembodiments, a backup may be performed on a regular basis. For example,in one embodiment, the backup may occur every millisecond in response toa trigger condition. In certain embodiments, the trigger conditionoccurs when the memory system 10 detects that the system voltage isbelow a certain threshold voltage. For example, in one embodiment, thethreshold voltage is 10 percent below a specified operating voltage. Incertain embodiments, a trigger condition occurs when the voltage goesabove a certain threshold value, such as, for example, 10 percent abovea specified operating voltage. In some embodiments, a trigger conditionoccurs when the voltage goes below a threshold or above anotherthreshold. In various embodiments, a backup and/or restore operation mayoccur in reboot and/or non-reboot trigger conditions.

As schematically illustrated by FIGS. 1 and 2, in certain embodiments,the controller 62 may comprise a microcontroller unit (MCU) 60 and alogic element 70. In certain embodiments, the MCU 60 provides memorymanagement for the non-volatile memory subsystem 40 and controls datatransfer between the volatile memory subsystem 30 and the non-volatilememory subsystem 40. The MCU 60 of certain embodiments comprises a16-bit microcontroller, although other types of microcontrollers arealso compatible with certain embodiments described herein. Asschematically illustrated by FIGS. 1 and 2, the logic element 70 ofcertain embodiments is in electrical communication with the non-volatilememory subsystem 40 and the MCU 60. The logic element 70 can providesignal level translation between the volatile memory elements 32 (e.g.,1.8V SSTL-2 for DDR2 SDRAM elements) and the non-volatile memoryelements 42 (e.g., 3V TTL for NAND flash memory elements). In certainembodiments, the logic element 70 is also programmed to performaddress/address translation between the volatile memory subsystem 30 andthe non-volatile memory subsystem 40. In certain preferred embodiments,1-NAND type flash are used for the non-volatile memory elements 42because of their superior read speed and compact structure.

The memory system 10 of certain embodiments is configured to be operatedin at least two states. The at least two states can comprise a firststate in which the controller 62 and the non-volatile memory subsystem40 are operatively decoupled (e.g., isolated) from the volatile memorysubsystem 30 by the at least one circuit 52 and a second state in whichthe volatile memory subsystem 30 is operatively coupled to thecontroller 62 to allow data to be communicated between the volatilememory subsystem 30 and the nonvolatile memory subsystem 40 via thecontroller 62. The memory system 10 may transition from the first stateto the second state in response to a trigger condition, such as when thememory system 10 detects that there is a power interruption (e.g., powerfailure or reduction) or a system hang-up.

The memory system 10 may further comprise a voltage monitor 50. Thevoltage monitor circuit 50 monitors the voltage supplied by the hostsystem via the interface 22. Upon detecting a low voltage condition(e.g., due to a power interruption to the host system), the voltagemonitor circuit 50 may transmit a signal to the controller 62 indicativeof the detected condition. The controller 62 of certain embodimentsresponds to the signal from the voltage monitor circuit 50 bytransmitting a signal to the at least one circuit 52 to operativelycouple the controller to the volatile memory system 30, such that thememory system 10 enters the second state. For example, the voltagemonitor 50 may send a signal to the MCU 60 which responds by accessingthe data on the volatile memory system 30 and by executing a write cycleon the non-volatile memory subsystem 40. During this write cycle, datais read from the volatile memory subsystem 30 and is transferred to thenon-volatile memory subsystem 40 via the MCU 60. In certain embodiments,the voltage monitor circuit 50 is part of the controller 62 (e.g., partof the MCU 60) and the voltage monitor circuit 50 transmits a signal tothe other portions of the controller 62 upon detecting a power thresholdcondition.

The isolation or operational decoupling of the volatile memory subsystem30 from the non-volatile memory subsystem in the first state canpreserve the integrity of the operation of the memory system 10 duringperiods of operation in which signals (e.g., data) are transmittedbetween the host system and the volatile memory subsystem 30. Forexample, in one embodiment during such periods of operation, thecontroller 62 and the nonvolatile memory subsystem 40 do not add asignificant capacitive load to the volatile memory system 30 when thememory system 10 is in the first state. In certain such embodiments, thecapacitive load of the controller 62 and the non-volatile memorysubsystem 40 do not significantly affect the signals propagating betweenthe volatile memory subsystem 30 and the host system. This can beparticularly advantageous in relatively high-speed memory systems whereloading effects can be significant. In one preferred embodiment, the atleast one circuit 52 comprises an FSA1208 Low-Power, Eight-Port,Hi-Speed Isolation Switch from Fairchild Semiconductor. In otherembodiments, the at least one circuit 52 comprises other types ofisolation devices.

Power may be supplied to the volatile memory subsystem 30 from a firstpower supply (e.g., a system power supply) when the memory system 10 isin the first state and from a second power supply 80 when the memorysystem 10 is in the second state. In certain embodiments, the memorysystem 10 is in the first state when no trigger condition (e.g., a powerfailure) is present and the memory system 10 enters the second state inresponse to a trigger condition. In certain embodiments, the memorysystem 10 has a third state in which the controller 62 is operativelydecoupled from the volatile memory subsystem 30 and power is supplied tothe volatile memory subsystem 30 from a third power supply (not shown).For example, in one embodiment the third power supply may provide powerto the volatile memory subsystem 30 when the memory system 10 detectsthat a trigger condition is likely to occur but has not yet occurred.

In certain embodiments, the second power supply 80 does not comprise abattery. Because a battery is not used, the second power supply 80 ofcertain embodiments may be relatively easy to maintain, does notgenerally need to be replaced, and is relatively environmentallyfriendly. In certain embodiments, as schematically illustrated by FIG.13, the second power supply 80 comprises a step-up transformer 82, astep-down transformer 84, and a capacitor bank 86 comprising one or morecapacitors (e.g., double-layer capacitors). In one example embodiment,capacitors may take about three to four minutes to charge and about twominutes to discharge. In other embodiments, the one or more capacitorsmay take a longer time or a shorter time to charge and/or discharge. Forexample, in certain embodiments, the second power supply 80 isconfigured to power the volatile memory subsystem 30 for less thanthirty minutes. In certain embodiments, the second power supply 80 maycomprise a battery. For example, in certain embodiments, the secondpower supply 80 comprises a battery and one or more capacitors and isconfigured to power the volatile memory subsystem 30 for no more thanthirty minutes.

In certain embodiments, the capacitor bank 86 of the second power supply80 is charged by the first power supply while the memory system 10 is inthe first state. As a result, the second power supply 80 is fullycharged when the memory system 10 enters the second state. The memorysystem 10 and the second power supply 80 may be located on the sameprinted circuit board 20. In other embodiments, the second power supply80 may not be on the same printed circuit board 20 and may be tetheredto the printed circuit board 20, for example.

When operating in the first state, in certain embodiments, the step-uptransformer 82 keeps the capacitor bank 86 charged at a peak value. Incertain embodiments, the step-down transformer 84 acts as a voltageregulator to ensure that regulated voltages are supplied to the memoryelements (e.g., 1.8V to the volatile DRAM elements 32 and 3.0V to thenon-volatile flash memory elements 42) when operating in the secondstate (e.g., during power down). In certain embodiments, asschematically illustrated by FIGS. 1-3, the memory module 10 furthercomprises a switch 90 (e.g., FET switch) that switches power provided tothe controller 62, the volatile memory subsystem 30, and thenon-volatile memory subsystem 40, between the power from the secondpower supply 80 and the power from the first power supply (e.g., systempower) received via the interface 22. For example, the switch 90 mayswitch from the first power supply to the second power supply 80 whenthe voltage monitor 50 detects a low voltage condition. The switch 90 ofcertain embodiments advantageously ensures that the volatile memoryelements 32 and non-volatile memory elements 42 are powered long enoughfor the data to be transferred from the volatile memory elements 32 andstored in the non-volatile memory elements 42. In certain embodiments,after the data transfer is complete, the switch 90 then switches back tothe first power supply and the controller 62 transmits a signal to theat least one circuit 52 to operatively decouple the controller 62 fromthe volatile memory subsystem 30, such that the memory system 10reenters the first state.

When the memory system 10 re-enters the first state, data may betransferred back from the non-volatile memory subsystem 40 to thevolatile memory subsystem 30 via the controller 62. The host system canthen resume accessing the volatile memory subsystem 30 of the memorymodule 10. In certain embodiments, after the memory system 10 enters orre-enters the first state (e.g., after power is restored), the hostsystem accesses the volatile memory subsystem 30 rather than thenon-volatile memory subsystem 40 because the volatile memory elements 32have superior read/write characteristics. In certain embodiments, thetransfer of data from the volatile memory bank 30 to the nonvolatilememory bank 40, or from the non-volatile memory bank 40 to the volatilememory bank 30, takes less than one minute per GB.

In certain embodiments, the memory system 10 protects the operation ofthe volatile memory when communicating with the host-system and providesbackup and restore capability in the event of a trigger condition suchas a power failure. In certain embodiments, the memory system 10 copiesthe entire contents of the volatile memory subsystem 30 into thenon-volatile memory subsystem 40 on each backup operation. Moreover, incertain embodiments, the entire contents of the non-volatile memorysubsystem 40 are copied back into the volatile memory subsystem 30 oneach restore operation. In certain embodiments, the entire contents ofthe non-volatile memory subsystem 40 are accessed for each backup and/orrestore operation, such that the non-volatile memory subsystem 40 (e.g.,flash memory subsystem) is used generally uniformly across its memoryspace and wear-leveling is not performed by the memory system 10. Incertain embodiments, avoiding wear-leveling can decrease cost andcomplexity of the memory system 10 and can improve the performance ofthe memory system 10. In certain other embodiments, the entire contentsof the volatile memory subsystem 30 are not copied into the non-volatilememory subsystem 40 on each backup operation, but only a partial copy isperformed. In certain embodiments, other management capabilities such asbad-block management and error management for the flash memory elementsof the non-volatile memory subsystem 40 are performed in the controller62.

The memory system 10 generally operates as a write-back cache in certainembodiments. For example, in one embodiment, the host system (e.g., adisk controller) writes data to the volatile memory subsystem 30 whichthen writes the data to non-volatile storage which is not part of thememory system 10, such as, for example, a hard disk. The disk controllermay wait for an acknowledgment signal from the memory system 10indicating that the data has been written to the hard disk or isotherwise secure. The memory system 10 of certain embodiments candecrease delays in the system operation by indicating that the data hasbeen written to the hard disk before it has actually done so. In certainembodiments, the memory system 10 will still be able to recover the dataefficiently in the event of a power outage because of the backup andrestore capabilities described herein. In certain other embodiments, thememory system 10 may be operated as a write-through cache or as someother type of cache.

FIG. 5 schematically illustrates an example power module 100 of thememory system 10 in accordance with certain embodiments describedherein. The power module 100 provides power to the various components ofthe memory system 10 using different elements based on a state of thememory system 10 in relation to a trigger condition. In certainembodiments, the power module 100 comprises one or more of thecomponents described above with respect to FIG. 1. For example, incertain embodiments, the power module 100 includes the second powersupply 80 and the switch 90.

The power module 100 provides a plurality of voltages to the memorysystem 10 comprising non-volatile and volatile memory subsystems 30, 40.The plurality of voltages comprises at least a first voltage 102 and asecond voltage 104. The power module 100 comprises an input 106providing a third voltage 108 to the power module 100 and a voltageconversion element 120 configured to provide the second voltage 104 tothe memory system 10. The power module 100 further comprises a firstpower element 130 configured to selectively provide a fourth voltage 110to the conversion element 120. In certain embodiments, the first powerelement 130 comprises a pulse-width modulation power controller. Forexample, in one example embodiment, the first power element 130 isconfigured to receive a 1.8V input system voltage as the third voltage108 and to output a modulated 5V output as the fourth voltage 110.

The power module 100 further comprises a second power element 140 can beconfigured to selectively provide a fifth voltage 112 to the conversionelement 120. The power module 100 can be configured to selectivelyprovide the first voltage 102 to the memory system 10 either from theconversion element 120 or from the input 106.

The power module 100 can be configured to be operated in at least threestates in certain embodiments. In a first state, the first voltage 102is provided to the memory system 10 from the input 106 and the fourthvoltage 110 is provided to the conversion element 120 from the firstpower element 130. In a second state, the fourth voltage 110 is providedto the conversion element 120 from the first power element 130 and thefirst voltage 102 is provided to the memory system 10 from theconversion element 120. In the third state, the fifth voltage 112 isprovided to the conversion element 120 from the second power element 140and the first voltage 104 is provided to the memory system 10 from theconversion element 120.

In certain embodiments, the power module 100 transitions from the firststate to the second state upon detecting that a trigger condition islikely to occur and transitions from the second state to the third stateupon detecting that the trigger condition has occurred. For example, thepower module 100 may transition to the second state when it detects thata power failure is about to occur and transitions to the third statewhen it detects that the power failure has occurred. In certainembodiments, providing the first voltage 102 in the second state fromthe first power element 130 rather than from the input 106 allows asmoother transition from the first state to the third state. Forexample, in certain embodiments, providing the first voltage 102 fromthe first power element 130 has capacitive and other smoothing effects.In addition, switching the point of power transition to be between theconversion element 120 and the first and second power elements 130, 140(e.g., the sources of the pre-regulated fourth voltage 110 in the secondstate and the pre-regulated fifth voltage 112 in the third state) cansmooth out potential voltage spikes.

In certain embodiments, the second power element 140 does not comprise abattery and may comprise one or more capacitors. For example, asschematically illustrated in FIG. 4, the second power element 140comprises a capacitor array 142, a buck-boost converter 144 whichadjusts the voltage for charging the capacitor array and avoltage/current limiter 146 which limits the charge current to thecapacitor array 142 and stops charging the capacitor array 142 when ithas reached a certain charge voltage. In one example embodiment, thecapacitor array 142 comprises two 50 farad capacitors capable of holdinga total charge of 4.6V. For example, in one example embodiment, thebuck-boost converter 144 receives a 1.8V system voltage (first voltage108) and boosts the voltage to 4.3V which is outputted to the voltagecurrent limiter 146. The voltage/current limiter 146 limits the currentgoing to the capacitor array 142 to 1A and stops charging the array 142when it is charged to 4.3V. Although described with respect to certainexample embodiments, one of ordinary skill will recognize from thedisclosure herein that the second power element 140 may includealternative embodiments. For example, different components and/ordifferent value components may be used. For example, in otherembodiments, a pure boost converter may be used instead of a buck-boostconverter. In another embodiment, only one capacitor may be used insteadof a capacitor array 142.

The conversion element 120 can comprise one or more buck convertersand/or one or more buck-boost converters. The conversion element 120 maycomprise a plurality of sub-blocks 122, 124, 126 as schematicallyillustrated by FIG. 4, which can provide more voltages in addition tothe second voltage 104 to the memory system 10. The sub-blocks maycomprise various converter circuits such as buck-converters, boostconverters, and buck-boost converter circuits for providing variousvoltage values to the memory system 10. For example, in one embodiment,sub-block 122 comprises a buck converter, sub-block 124 comprises a dualbuck converter, and sub-block 126 comprises a buck-boost converter asschematically illustrated by FIG. 4. Various other components for thesub-blocks 122, 124, 126 of the conversion element 120 are alsocompatible with certain embodiments described herein. In certainembodiments, the conversion element 120 receives as input either thefourth voltage 110 from the first power element 130 or the fifth voltage112 from the second power element 140, depending on the state of thepower module 100, and reduces the input to an appropriate amount forpowering various components of the memory system. For example, thebuck-converter of sub-block 122 can provide 1.8V at 2A for about 60seconds to the volatile memory elements 32 (e.g., DRAM), thenon-volatile memory elements 42 (e.g., flash), and the controller 62(e.g., an FPGA) in one embodiment. The sub-block 124 can provide thesecond voltage 104 as well as another reduced voltage 105 to the memorysystem 10. In one example embodiment, the second voltage 104 is 2.5V andis used to power the at least one circuit 52 (e.g., isolation device)and the other reduced voltage 105 is 1.2V and is used to power thecontroller 62 (e.g., FPGA). The sub-block 126 can provide yet anothervoltage 107 to the memory system 10. For example, the voltage 107 may be3.3V and may be used to power both the controller 62 and the at leastone circuit 52.

Although described with respect to certain example embodiments, one ofordinary skill will recognize from the disclosure herein that theconversion element 120 may include alternative embodiments. For example,there may be more or less sub-blocks which may comprise other types ofconverters (e.g., pure boost converters) or which may produce differentvoltage values. In one embodiment, the volatile memory elements 32 andnonvolatile memory elements 42 are powered using independent voltagesand are not both powered using the first voltage 102.

FIG. 6 is a flowchart of an example method 200 of providing a firstvoltage 102 and a second voltage 104 to a memory system 10 includingvolatile and nonvolatile memory subsystems 30, 40. While the method 200is described herein by reference to the memory system 10 schematicallyillustrated by FIGS. 1-4, other memory systems are also compatible withembodiments of the method 200. During a first condition, the method 200comprises providing the first voltage 102 to the memory system 10 froman input power supply 106 and providing the second voltage 104 to thememory system 10 from a first power subsystem in operational block 210.For example, in one embodiment, the first power subsystem comprises thefirst power element 130 and the voltage conversion element 120 describedabove with respect to FIG. 4. In other embodiments, other first powersubsystems are used.

The method 200 further comprises detecting a second condition inoperational block 220. In certain embodiments, detecting the secondcondition comprises detecting that a trigger condition is likely tooccur. During the second condition, the method 200 comprises providingthe first voltage 102 and the second voltage 104 to the memory system 10from the first power subsystem in an operational block 230. For example,referring to FIG. 4, a switch 148 can be toggled to provide the firstvoltage 102 from the conversion element 120 rather than from the inputpower supply.

The method 200 further comprises charging a second power subsystem inoperational block 240. In certain embodiments, the second powersubsystem comprises the second power element 140 or another power supplythat does not comprise a battery. For example, in one embodiment, thesecond power subsystem comprises the second power element 140 and thevoltage conversion element 120 described above with respect to FIG. 4.In other embodiments, some other second power subsystem is used.

The method 200 further comprises detecting a third condition in anoperational block 250 and during the third condition, providing thefirst voltage 102 and the second voltage 104 to the memory system 10from the second power subsystem 140 in an operational block 250. Incertain embodiments, detecting the third condition comprises detectingthat the trigger condition has occurred. The trigger condition maycomprise various conditions described herein. In various embodiments,for example, the trigger condition comprises a power reduction, powerfailure, or system hang-up. The operational blocks of the method 200 maybe performed in different orders in various embodiments. For example, incertain embodiments, the second power subsystem 140 is charged beforedetecting the second condition.

In certain embodiments, the memory system 10 comprises a volatile memorysubsystem 30 and a non-volatile memory subsystem 40 comprising at least100 percent more storage capacity than does the volatile memorysubsystem. The memory system 10 also comprises a controller 62operatively coupled to the volatile memory subsystem 30 and operativelycoupled to the non-volatile memory subsystem 40. The controller 62 canbe configured to allow data to be communicated between the volatilememory subsystem 30 and the host system when the memory system 10 isoperating in a first state and to allow data to be communicated betweenthe volatile memory subsystem 30 and the non-volatile memory subsystem40 when the memory system 10 is operating in a second state.

Although the memory system 10 having extra storage capacity of thenon-volatile memory subsystem 40 has been described with respect tocertain embodiments, alternative configurations exist. For example, incertain embodiments, there may be more than 100 percent more storagecapacity in the non-volatile memory subsystem 40 than in the volatilememory subsystem 30. In various embodiments, there may be at least 200,300, or 400 percent more storage capacity in the non-volatile memorysubsystem 40 than in the volatile memory subsystem 30. In otherembodiments, the non-volatile memory subsystem 40 includes at least someother integer multiples of the storage capacity of the volatile memorysubsystem 30. In some embodiments, the non-volatile memory subsystem 40includes a non-integer multiple of the storage capacity of the volatilememory subsystem 30. In one embodiment, the non-volatile memorysubsystem 40 includes less than 100 percent more storage capacity thandoes the volatile memory subsystem 30.

The extra storage capacity of the non-volatile memory subsystem 40 canbe used to improve the backup capability of the memory system 10. Incertain embodiments in which data can only be written to portions of thenon-volatile memory subsystem 40 which do not contain data (e.g.,portions which have been erased), the extra storage capacity of thenon-volatile memory subsystem 40 allows the volatile memory subsystem 30to be backed up in the event of a subsequent power failure or othertrigger event. For example, the extra storage capacity of thenon-volatile memory subsystem 40 may allow the memory system 10 tobackup the volatile memory subsystem 30 efficiently in the event ofmultiple trigger conditions (e.g., power failures). In the event of afirst power failure, for example, the data in the volatile memory system30 is copied to a first, previously erased portion of the nonvolatilememory subsystem 40 via the controller 62. Since the non-volatile memorysubsystem 40 has more storage capacity than does the volatile memorysubsystem 30, there is a second portion of the non-volatile memorysubsystem 40 which does not have data from the volatile memory subsystem30 copied to it and which remains free of data (e.g., erased). Oncesystem power is restored, the controller 62 of the memory system 10restores the data to the volatile memory subsystem 30 by copying thebacked-up data from the non-volatile memory subsystem 40 back to thevolatile memory subsystem 30. After the data is restored, the memorysystem 10 erases the non-volatile memory subsystem 40. While the firstportion of the non-volatile memory subsystem 40 is being erased, it maybe temporarily unaccessible.

If a subsequent power failure occurs before the first portion of thenon-volatile memory subsystem 40 is completely erased, the volatilememory subsystem 30 can be backed-up or stored again in the secondportion of the non-volatile memory subsystem 40 as described herein. Incertain embodiments, the extra storage capacity of the non-volatilememory subsystem 40 may allow the memory system 10 to operate moreefficiently. For example, because of the extra storage capacity of thenon-volatile memory subsystem 40, the memory system 10 can handle ahigher frequency of trigger events that is not limited by the erase timeof the non-volatile memory subsystem 40.

FIG. 7 is a flowchart of an example method 300 of controlling a memorysystem 10 operatively coupled to a host system and which includes avolatile memory subsystem 30 and a non-volatile memory subsystem 40. Incertain embodiments, the non-volatile memory subsystem 40 comprises atleast 100 percent more storage capacity than does the volatile memorysubsystem 30 as described herein. While the method 300 is describedherein by reference to the memory system 10 schematically illustrated byFIGS. 1-3, the method 300 can be practiced using other memory systems inaccordance with certain embodiments described herein. In an operationalblock 310, the method 300 comprises communicating data between thevolatile memory subsystem 30 and the host system when the memory system10 is in a first mode of operation. The method 300 further comprisesstoring a first copy of data from the volatile memory subsystem 30 tothe non-volatile memory subsystem 40 at a first time when the memorysystem 10 is in a second mode of operation in an operational block 320.

In an operational block 330, the method 300 comprises restoring thefirst copy of data from the non-volatile memory subsystem 40 to thevolatile memory subsystem 30. The method 300 further comprises erasingthe first copy of data from the non-volatile memory subsystem 40 in anoperational block 340. The method further comprises storing a secondcopy of data from the volatile memory subsystem 30 to the non-volatilememory subsystem 40 at a second time when the memory system 10 is in thesecond mode of operation in an operational block 350. Storing the secondcopy begins before the first copy is completely erased from thenon-volatile memory subsystem 40.

In some embodiments, the memory system 10 enters the second mode ofoperation in response to a trigger condition, such as a power failure.In certain embodiments, the first copy of data and the second copy ofdata are stored in separate portions of the nonvolatile memory subsystem40. The method 300 can also include restoring the second copy of datafrom the non-volatile memory subsystem 40 to the volatile memorysubsystem 30 in an operational block 360. The operational blocks ofmethod 300 referred to herein may be performed in different orders invarious embodiments. For example, in some embodiments, the second copyof data is restored to the volatile memory subsystem 30 at operationalblock 360 before the first copy of data is completely erased in theoperational block 340.

FIG. 8 schematically illustrates an example clock distribution topology400 of a memory system 10 in accordance with certain embodimentsdescribed herein. The clock distribution topology 400 generallyillustrates the creation and routing of the clock signals provided tothe various components of the memory system 10. A clock source 402 suchas, for example, a 25 MHz oscillator, generates a clock signal. Theclock source 402 may feed a clock generator 404 which provides a clocksignal 406 to the controller 62, which may be an FPGA. In oneembodiment, the clock generator 404 generates a 125 MHz clock signal406. The controller 62 receives the clock signal 406 and uses it toclock the controller 62 master state control logic. For example, themaster state control logic may control the general operation of an FPGAcontroller 62.

The clock signal 406 can also be input into a clock divider 410 whichproduces a frequency-divided version of the clock signal 406. In anexample embodiment, the clock divider 410 is a divide by two clockdivider and produces a 62.5 MHz clock signal in response to the 125 MHzclock signal 406. A non-volatile memory phase-locked loop (PLL) block412 can be included (e.g., in the controller 62) which distributes aseries of clock signals to the non-volatile memory subsystem 40 and toassociated control logic. For example, a series of clock signals 414 canbe sent from the controller 62 to the non-volatile memory subsystem 40.Another clock signal 416 can be used by the controller logic which isdedicated to controlling the non-volatile memory subsystem 40. Forexample, the clock signal 416 may clock the portion of the controller 62which is dedicated to generating address and/or control lines for thenon-volatile memory subsystem 40. A feedback clock signal 418 is fedback into the non-volatile memory PLL block 412. In one embodiment, thePLL block 412 compares the feedback clock 418 to the reference clock 411and varies the phase and frequency of its output until the reference 411and feedback 418 clocks are phase and frequency matched.

A version of the clock signal 406 such as the backup clock signal 408may be sent from the controller to the volatile memory subsystem 30. Theclock signal 408 may be, for example, a differential version of theclock signal 406. As described herein, the backup clock signal 408 maybe used to clock the volatile memory subsystem 30 when the memory system10 is backing up the data from the volatile memory subsystem 30 into thenon-volatile memory subsystem 40. In certain embodiments, the backupclock signal 408 may also be used to clock the volatile memory subsystem30 when the memory system 10 is copying the backed-up data back into thevolatile memory subsystem 30 from the nonvolatile memory subsystem 40(also referred to as restoring the volatile memory subsystem 30). Thevolatile memory subsystem 30 may normally be run at a higher frequency(e.g., DRAM running at 400 MHz) than the non-volatile memory subsystem40 (e.g., flash memory running at 62.5 MHz) when communicating with thehost system (e.g., when no trigger condition is present). However, incertain embodiments the volatile memory subsystem 30 may be operated ata reduced frequency (e.g., at twice the frequency of the non-volatilememory subsystem 40) without introducing significant delay into thesystem during backup operation and/or restore operations. Running thevolatile memory subsystem 30 at the reduced frequency during a backupand/or restore operation may advantageously reduce overall powerconsumption of the memory system 10.

In one embodiment, the backup clock 408 and the volatile memory systemclock signal 420 are received by a multiplexer 422, as schematicallyillustrated by FIG. 8. The multiplexer 422 can output either thevolatile memory system clock signal 420 or the backup clock signal 408depending on the backup state of the memory system 10. For example, whenthe memory system 10 is not performing a backup or restore operation andis communicating with the host system (e.g., normal operation), thevolatile memory system clock signal 420 may be provided by themultiplexer 422 to the volatile memory PLL block 424. When the memorysystem 10 is performing a backup (or restore) operation, the backupclock signal 408 may be provided.

The volatile memory PLL block 424 receives the volatile memory referenceclock signal 423 from the multiplexer 422 and can generate a series ofclock signals which are distributed to the volatile memory subsystem 30and associated control logic. For example, in one embodiment, the PLLblock 424 generates a series of clock signals 426 which clock thevolatile memory elements 32. A clock signal 428 may be used to clockcontrol logic associated with the volatile memory elements, such as oneor more registers (e.g., the one ore more registers of a registeredDIMM). Another clock signal 430 may be sent to the controller 62. Afeedback clock signal 432 is fed back into the volatile memory PLL block424. In one embodiment, the PLL block 424 compares the feedback clocksignal 432 to the reference clock signal 423 and varies the phase andfrequency of its output until the reference clock signal 423 and thefeedback clock signal 432 clocks are phase and frequency matched.

The clock signal 430 may be used by the controller 62 to generate anddistribute clock signals which will be used by controller logic which isconfigured to control the volatile memory subsystem 30. For example,control logic in the controller 62 may be used to control the volatilememory subsystem 30 during a backup or restore operation. The clocksignal 430 may be used as a reference clock signal for the PLL block 434which can generate one or more clocks 438 used by logic in thecontroller 62. For example, the PLL block 434 may generate one or moreclock signals 438 used to drive logic circuitry associated withcontrolling the volatile memory subsystem 30. In certain embodiments,the PLL block 434 includes a feedback clock signal 436 and operates in asimilar manner to other PLL blocks described herein.

The clock signal 430 may be used as a reference clock signal for the PLLblock 440 which may generate one or more clock signals used by asub-block 442 to generate one or more other clock signals 444. In oneembodiment, for example, the volatile memory subsystem 30 comprises DDR2SDRAM elements and the sub-block 442 generates one or more DDR2compatible clock signals 444. A feedback clock signal 446 is fed backinto the PLL block 440. In certain embodiments, the PLL block 440operates in a similar manner to other PLL blocks described herein.

While described with respect to the example embodiment of FIG. 8,various alternative clock distribution topologies are possible. Forexample, one or more of the clock signals have a different frequency invarious other embodiments. In some embodiments, one or more of theclocks shown as differential signals are single ended signals. In oneembodiment, the volatile memory subsystem 30 operates on the volatilememory clock signal 420 and there is no backup clock signal 408. In someembodiments, the volatile memory subsystem 30 is operated at a reducedfrequency during a backup operation and not during a restore operation.In other embodiments, the volatile memory subsystem 30 is operated at areduced frequency during a restore operation and not during a backupoperation.

FIG. 9 is a flowchart of an example method 500 of controlling a memorysystem 10 operatively coupled to a host system. Although described withrespect to the memory system 10 described herein, the method 500 iscompatible with other memory systems. The memory system 10 may include aclock distribution topology 400 similar to the one described above withrespect to FIG. 8 or another clock distribution topology. The memorysystem 10 can include a volatile memory subsystem 30 and a non-volatilememory subsystem 40.

In an operational block 510, the method 500 comprises operating thevolatile memory subsystem 30 at a first frequency when the memory system10 is in a first mode of operation in which data is communicated betweenthe volatile memory subsystem 30 and the host system. In an operationalblock 520, the method 500 comprises operating the non-volatile memorysubsystem 40 at a second frequency when the memory system 10 is in asecond mode of operation in which data is communicated between thevolatile memory subsystem 30 and the non-volatile memory subsystem 40.The method 500 further comprises operating the volatile memory subsystem30 at a third frequency in an operational block 530 when the memorysystem 10 is in the second mode of operation. In certain embodiments,the memory system 10 is not powered by a battery when it is in thesecond mode of operation. The memory system 10 may switch from the firstmode of operation to the second mode of operation in response to atrigger condition. The trigger condition may be any trigger conditiondescribed herein such as, for example, a power failure condition. Incertain embodiments, the second mode of operation includes both backupand restore operations as described herein. In other embodiments, thesecond mode of operation includes backup operations but not restoreoperations. In yet other embodiments, the second mode of operationincludes restore operations but not backup operations.

The third frequency can be less than the first frequency. For example,the third frequency can be approximately equal to the second frequency.In certain embodiments, the reduced frequency operation is an optionalmode. In yet other embodiments, the first, second and/or thirdfrequencies are configurable by a user or by the memory system 10.

FIG. 10 schematically illustrates an example topology of a connection totransfer data slices from two DRAM segments 630, 640 of a volatilememory subsystem 30 of a memory system 10 to a controller 62 of thememory system 10. While the example of FIG. 10 shows a topologyincluding two DRAM segments 630, 640 for the purposes of illustration,each address location of the volatile memory subsystem 30 comprises morethan the two segments in certain embodiments. The data lines 632, 642from the first DRAM segment 630 and the second DRAM segment 640 of thevolatile memory subsystem 30 are coupled to switches 650, 652 which arecoupled to the controller 62 (e.g., logic element 70) of the memorysystem 10. The chip select lines 634, 644 and the self-refresh lines636, 646 (e.g., CKe signals) of the first and second DRAM segments 630,640, respectively, are coupled to the controller 62. In certainembodiments, the controller 62 comprises a buffer (not shown) which isconfigured to store data from the volatile memory subsystem 30. Incertain embodiments, the buffer is a first-in, first out buffer (FIFO).In certain embodiments, data slices from each DRAM segment 630, 640comprise a portion of the volatile memory subsystem data bus. In oneembodiment, for example, the volatile memory subsystem 30 comprises a72-bit data bus (e.g., each data word at each addressable location is 72bits wide and includes, for example, 64 bits of accessible SDRAM and 8bits of ECC), the first data slice from the first DRAM segment 630 maycomprise 40 bits of the data word, and the second data slice from thesecond DRAM segment 640 may comprise the remaining 32 bits of the dataword. Certain other embodiments comprise data buses and/or data slicesof different sizes.

In certain embodiments, the switches 650, 652 can each be selectivelyswitched to selectively operatively couple the data lines 632, 642,respectively from the first and second DRAM segments 630, 640 to thecontroller 62. The chip select lines 634, 644 enable the first andsecond DRAM segments 630, 640, respectively, of the volatile memorysubsystem 30, and the self-refresh lines 636, 646 toggle the first andsecond DRAM segments 630, 640, respectively, from self-refresh mode toactive mode. In certain embodiments, the first and second DRAM segments630, 640 maintain stored information but are not accessible when theyare in self-refresh mode, and maintain stored information and areaccessible when they are in active mode.

In certain embodiments, when the memory system 10 is backing up thevolatile memory system 30, data slices from only one of the two DRAMsegments 630, 640 at a time are sent to the controller 62. For example,when the first slice is being written to the controller 62 during aback-up, the controller 62 sends a signal via the CKe line 636 to thefirst DRAM segment 630 to put the first DRAM segment 630 in active mode.In certain embodiments, the data slice from the first DRAM segment 630for multiple words (e.g., a block of words) is written to the controller62 before writing the second data slice from the second DRAM segment 640to the controller 62. While the first data slice is being written to thecontroller 62, the controller 62 also sends a signal via the CKe line646 to put the second DRAM segment 640 in self-refresh mode. Once thefirst data slice for one word or for a block of words is written to thecontroller 62, the controller 62 puts the first DRAM segment 630 intoself-refresh mode by sending a signal via the CKe line 636 to the firstDRAM segment 640. The controller 62 also puts the second. DRAM segment640 into active mode by sending a signal via the CKe line 646 to theDRAM segment 640. The second slice for a word or for a block of words iswritten to the controller 62. In certain embodiments, when the first andsecond data slices are written to the buffer in the controller 62, thecontroller 62 combines the first and second data slices 630, 640 intocomplete words or blocks of words and then writes each complete word orblock of words to the non-volatile memory subsystem 40. In certainembodiments, this process is called “slicing” the volatile memorysubsystem 30.

In certain embodiments, the data may be sliced in a restore operation aswell as, or instead of, during a backup operation. For example, in oneembodiment, the nonvolatile memory elements 42 write each backed-up dataword to the controller 62 which writes a first slice of the data word tothe volatile memory subsystem 30 and then a second slice of the dataword to the volatile memory subsystem 30. In certain embodiments,slicing the volatile memory subsystem 30 during a restore operation maybe performed in a manner generally inverse to slicing the volatilememory subsystem 30 during a backup operation.

FIG. 11 is a flowchart of an example method 600 of controlling a memorysystem 10 operatively coupled to a host system and which includes avolatile memory subsystem 30 and a non-volatile memory subsystem 40.Although described with respect to the memory system 10 described hereinwith respect to FIGS. 1-3 and 10, the method 600 is compatible withother memory systems. The method 600 comprises communicating data wordsbetween the volatile memory subsystem 30 and the host system when thememory system 10 is in a first mode of operation in an operational block610. For example, the memory system 10 may be in the first mode ofoperation when no trigger condition has occurred and the memory systemis not performing a backup and/or restore operation or is not beingpowered by a secondary power supply.

In an operational block 620, the method further comprises transferringdata words from the volatile memory subsystem 30 to the non-volatilememory subsystem 40 when the memory system 10 is in a second mode ofoperation. In certain embodiments, each data word comprises the datastored in a particular address of the memory system 10. The memorysystem 10 may enter the second mode of operation, for example, when atrigger condition (e.g., a power failure) occurs. In certainembodiments, transferring each data word comprises storing a firstportion (also referred to as a slice) of the data word in a buffer in anoperational block 622, storing a second portion of the data word in thebuffer in an operational block 624, and writing the entire data wordfrom the buffer to the non-volatile memory subsystem 40 in anoperational block 626.

In one example embodiment, the data word may be a 72 bit data word(e.g., 64 bits of accessible SDRAM and 8 bits of ECC), the first portion(or “slice”) may comprise 40 bits of the data word, and the secondportion (or “slice”) may comprise the remaining 32 bits of the dataword. In certain embodiments, the buffer is included in the controller62. For example, in one embodiment, the buffer is a first-in, first-outbuffer implemented in the controller 62 which comprises an FPGA. Themethod 600 may generally be referred to as “slicing” the volatile memoryduring a backup operation. In the example embodiment, the process of“slicing” the volatile memory during a backup includes bringing the32-bit slice out of self-refresh, reading a 32-bit block from the sliceinto the buffer, and putting the 32-bit slice back into self-refresh.The 40-bit slice is then brought out of self-refresh and a 40-bit blockfrom the slice is read into a buffer. Each block may comprise a portionof multiple words. For example, each 32-bit block may comprise 32-bitportions of multiple 72-bit words. In other embodiments, each blockcomprises a portion of a single word. The 40-bit slice is then put backinto self-refresh in the example embodiment. The 32-bit and 40-bitslices are then combined into a 72-bit block by the controller 62 andECC detection/correction is performed on each 72-bit word as it is readfrom the buffer and written into the non-volatile memory subsystem(e.g., flash).

In some embodiments, the entire data word may comprise more than twoportions. For example, the entire data word may comprise three portionsinstead of two and transferring each data word further comprises storinga third portion of each data word in the buffer. In certain otherembodiments, the data word may comprise more than three portions.

In certain embodiments, the data may be sliced in a restore operation aswell as, or instead of, during a backup operation. For example, in oneembodiment, the nonvolatile memory elements 40 write each backed-up dataword to the controller 62 which writes a first portion of the data wordto the volatile memory subsystem 30 and then a second portion of thedata word to the volatile memory 30. In certain embodiments, slicing thevolatile memory subsystem 30 during a restore operation may be performedin a manner generally inverse to slicing the volatile memory subsystem30 during a backup operation.

The method 600 can advantageously provide significant power savings andcan lead to other advantages. For example, in one embodiment where thevolatile memory subsystem 30 comprises DRAM elements, only the slice ofthe DRAM which is currently being accessed (e.g., written to the buffer)during a backup is configured in full-operational mode. The slice orslices that are not being accessed may be put in self-refresh mode.Because DRAM in self-refresh mode uses significantly less power thanDRAM in full-operational mode, the method 600 can allow significantpower savings. In certain embodiments, each slice of the DRAM includes aseparate self-refresh enable (e.g., CKe) signal which allows each sliceto be accessed independently.

In addition, the connection between the DRAM elements and the controller62 may be as large as the largest slice instead of as large as the databus. In the example embodiment, the connection between the controller 62and the DRAM may be 40 bits instead of 72 bits. As a result, pins on thecontroller 62 may be used for other purposes or a smaller controller maybe used due to the relatively low number of pin-outs used to connect tothe volatile memory subsystem 30. In certain other embodiments, the fullwidth of the data bus is connected between the volatile memory subsystem30 and the controller 62 but only a portion of it is used during slicingoperations. For example, in some embodiments, memory slicing is anoptional mode.

Various embodiments of the present invention have been described above.Although this invention has been described with reference to thesespecific embodiments, the descriptions are intended to be illustrativeof the invention and are not intended to be limiting. Variousmodifications and applications may occur to those skilled in the artwithout departing from the true spirit and scope of the invention asdefined in the appended claims.

1. A memory module comprising: a volatile memory subsystem having afirst storage capacity; a nonvolatile memory subsystem having a secondstorage capacity, the second storage capacity being at least 400 percentmore than the first storage capacity, wherein the memory module isconfigured to provide non-volatile storage via the non-volatile memorysubsystem; a standard DIMM interface configured to electrically couplethe memory module to a host system, the standard DIMM interfaceincluding an edge connector which fits into a memory socket of the hostsystem, the edge connector including a plurality of edge connections toprovide a first signals path for transmitting a first plurality of dualdata rate synchronous DRAM (DDR SDRAM) signals between the memory moduleand the host system, the first plurality of DDR SDRAM signals includingat least address/control and data signals, wherein data is communicatedbetween the volatile memory subsystem and the host system using thefirst signals path; and a controller in communication with the volatilememory subsystem via a second signals path for transmitting a secondplurality of DDR SDRAM signals between the controller and the volatilememory subsystem, the second plurality of DDR SDRAM signals including atleast address/control and data signals, the controller being coupled tothe nonvolatile memory subsystem via a third signals path fortransmitting at least data, address and control signals between thecontroller and the nonvolatile memory subsystem, wherein the controllerincludes: a logic element operable to generate address and controlsignals for the nonvolatile memory subsystem, wherein the logic elementperforms address-to-address translation between the volatile memorysubsystem and the nonvolatile memory subsystem, and a microcontrolleroperable to control data transfer between the volatile memory subsystemand the nonvolatile memory subsystem, wherein the controller isconfigured (i) to communicate data with the volatile memory subsystemusing the second plurality of DDR SDRAM signals via the second signalspath, and (ii) to communicate data with the nonvolatile memory subsystemusing the at least data, address and control signals via the thirdsignals path. 2.-20. (canceled)